Machine-Win
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| Parameter Category | Parameter Name | Specification & Description |
|---|---|---|
| Basic Information | Product Name | Lead-Free Solder Paste / Silver Tin Soldering Paste / Tin Cream |
| Alloy Composition | Sn96.5% (Tin), Ag3.0% (Silver), Cu0.5% (Copper) | |
| Appearance | Uniform gray paste; no agglomeration, no obvious particles, no delamination | |
| Alloy Characteristics | Melting Point Range | 217°C - 220°C |
| Metal Content (Weight %) | 88% - 92% (typical: 90%±1%, adjustable based on soldering requirements) | |
| Solder Powder Size Distribution | 25 - 45μm (standard); 38 - 75μm (for low-precision printing, matching stencil aperture) | |
| Solder Powder Shape | Near-spherical; sphericity ≥ 85% | |
| Flux Characteristics | Flux Type | No-Clean Flux / Water-Soluble Flux / Rosin-Based Flux (optional) |
| Flux Content (Weight %) | 8% - 12% (complementary to metal content) | |
| Halogen Content | < 500ppm (Halogen-free compliant); optional high-standard: < 150ppm | |
| Activity Level (ROHS) | RMA (Medium Activity) / RA (High Activity) (selected by base material oxidation degree) | |
| Soldering Performance | Wettability | Wettability rating ≥ Grade 3 at 235°C±5°C (per IPC-TM-650 2.4.12 standard) |
| Post-Soldering Residue | Minimal, transparent, non-corrosive; no cleaning required (for no-clean type) | |
| Voiding Rate | < 5% (for BGA/CSP solder joints, tested by X-Ray) | |
| Physical Properties | Viscosity (25°C, 10rpm) | 150 - 250 Pa·s (Brookfield Viscometer RVDV-II+Pro, RV/HA spindle) |
| Thixotropic Index (TI) | 3.0 - 5.0 (TI = Viscosity at 1rpm / Viscosity at 10rpm) | |
| Slump Resistance | < 20% (no obvious slump of printed patterns after 1 hour at 25°C) | |
| Environmental & Storage | Environmental Standard | Compliant with RoHS 2.0 (EU 2011/65/EU) and REACH Regulation |
| Storage Condition | Sealed and refrigerated at 0°C - 10°C | |
| Shelf Life | 6 months (unopened, under recommended storage conditions) | |
| Temperature Recovery | Recover at room temperature (20°C - 25°C) for ≥4 hours; heating recovery after opening is forbidden | |
| Application Compatibility | Applicable Soldering Process | Surface Mount Technology (SMT), Reflow Soldering |
| Applicable Base Materials | Common PCB pad materials: copper, nickel-plated, tin-plated, etc. | |
| Printing Requirements | Suitable stencil thickness: 0.12 - 0.15mm; Printing speed: 20 - 50mm/s | |
| Post-Soldering Reliability | Shear Strength | ≥ 30MPa (tested at 25°C) |
| Temperature Resistance | Withstands thermal shock cycles (-40°C to 125°C) for ≥500 times without solder joint failure | |
| Corrosion Resistance | No obvious corrosion/oxidation on solder joints after 96-hour salt spray test (5% NaCl, 35°C) |
